What is BGA
Did you know? In electronic devices, most high-performance chips use a packaging technology called BGA . So, what is BGA and what are its advantages? BGA (Ball Grid Array) is a common type of integrated circuit packaging widely used in high-density PCBs. Compared to traditional pin-type packages (such as QFP), BGA packaging uses an array of solder balls arranged at the bottom of the chip to connect with the PCB. The soldering method for BGA usually employs reflow soldering technology. Features of BGA: 1. Connection Method: BGA uses an array of solder balls to connect with pads on the PCB, which effectively reduces the number of connections and increases the connection density." 2. Thermal Management: Due to the even distribution of solder balls, BGA offers better heat dissipation, making it suitable for high-power chips and high-speed circuits 3. Space Utilization: ...