Applications of Glass PCBs in Communication Equipment
With the continued development of artificial intelligence (AI), cloud computing, big data, and high-speed network infrastructure, communication equipment is evolving toward higher bandwidth, greater integration, and faster data transmission rates. From data center switches and optical communication equipment to core network equipment, the growing demand for high-speed data transmission is placing greater demands on electronic systems in terms of system integration, signal integrity, and long-term reliability. Driven by these trends, electronic interconnect technologies are evolving toward higher density, greater precision, and higher-speed signal transmission. At the same time, new substrate materials and advanced interconnect platforms are attracting increasing attention. Compared with conventional FR-4 substrates, glass-based substrates offer several potential advantages, including a lower coefficient of thermal expansion (CTE...