What is the Process of PCB Solder Mask Technology
The purpose of the solder mask is to prevent conductor from being stained with tin, prevent short circuits between conductors caused by moisture, chemicals, etc., prevent circuit interruption and insulation caused by poor operation during production and assembly, and resist various harsh environments. It is also used to ensure the functionality of printed circuit board. So do you know what the process of this technology is? 1. Mixing of Solder Mask Inks The mixing of solder mask ink can be done by manual stirring, mechanical stirring and oscillation. Some solder mask inks need to be added diluent to reduce viscosity. The ink needs to be left for a certain period of time after mixing, usually more than 15 minutes. The purpose is not only to maintain the temperature and viscosity, but also to facilitate the escape of air brought in during stirring. 2. Pretreatment Pretreatment refers to removing oxides, grease and impurities on the board surfa...