PCB Blogger-China PCB Factory,HOYOGO

       As the demand for automotive electronic equipment continues to grow, how to improve the reliability and performance of electronic components has become a critical problem. In this regard, ceramic PCBs have gradually become an ideal solution due to their excellent electrical insulation and thermal conductivity, especially their stable performance in high-temperature environments.   Superior  P erformance of   C eramic  S ubstrates Ceramic PCBs usually use ceramic substrate materials such as alumina (Al ₂ O ₃ ) or aluminum nitride (AlN).  Among them, alumina is a common ceramic material with moderate cost, excellent mechanical strength, and outstanding electrical insulation performance. Therefore, it is widely used in various fields including electronic equipment. Aluminum nitride is  highly regarded  for its excellent thermal conductivity and relatively low thermal expansion coefficient, which is particularly suitable for high...

       DPC(Direct Plating Copper) technology and DBC(Direct Bond Copper) technology are two commonly used ceramic substrate manufacturing technologies.  While they are both method for manufacturing ceramic substrate, there are some important differences between them that make the DPC  technology   more expensive than the DBC technology.   1.  Definition DPC  Technology : It refers to a technology of plating copper directly on the ceramic surface. It can be achieved by electroplating or  hot plating . DBC  Technology:   It refers to a technology that directly combines  copper and ceramics. It is usually made by adding oxygen element between copper and ceramics , followed by  chemical metallurgical bonding.     2.   Advantages DPC Technology: 1)  The temperature  of  magnetron sputtering  technology  is below 300°C, completely avoiding the adverse effects of high tempera...