What is the Role of SPI in SMT Placement Processing
SPI, the full name is Solder Paste Inspection. This is a quality control method used during SMT placement processing. So do you know what role SPI plays in the SMT placement processing? 1. Check SMD Q uality SPI is used to check and verify the quality of the solder paste attached to the circuit board. The solder paste is printed on the component pad on the surface of the circuit board through a stencil during the SMT placement process, so SPI can ensure the uniformity, proper amount and precise position of the solder paste. 2. Avoid D efects The SPI system can detect parameters such as solder paste thickness, position and shape, thereby helping to prevent soldering defects such as insufficient solder paste, excessive solder paste, offset solder paste and other problems. 3. Improve M anufacturing E fficiency By monitoring the quality of solder paste in real tim...