The Relationship between Prepreg and PCB Lamination Technology Conditions
Under certain high temperature conditions, the resin melt viscosity of the prepreg is closely related to the lamination technology of the PCB board. Optimizing the matching and coordination between the two can significantly improve the appearance and internal performance of multilayer boards The lamination of multilayer PCB is mainly controlled by pressure, temperature and time. The entire lamination process can be divided into three stages: preheating, holding and cooling. The preheating stage is the key to ensuring PCB board performance and is also the stage for flexible use of different technology conditions. During the preheating stage, the prepreg resin is softened by heating and gradually transforms into a liquid, viscous, or gel state. At the same time, under heating and pressurization conditions, the resin further penetrates and fills the gaps in the glass fibers to complete the lamination exhaust and achieve the initial bondi...