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目前显示的是标签为“PCB Warpage”的博文

How to Avoid PCB Warpage

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      When the PCB is deformed, it is easy to cause problems such as poor circuit connection, component damage, signal interference, etc., and may even seriously threaten the quality and performance of the entire product. So how can we avoid PCB warping?       1.  Design Stage 1)  Reasonable layout of  component s We should tr y to avoid large  component s concentrated in the same area, forming a huge tension difference with other small  component s.  This can effectively reduce the PCB warpage problem caused by local stress.     2)  Control the thickness of copper foil The thickness of the copper foil in the PCB will also affect its warpage. Therefore, we need to make reasonable planning at the design stage, and control the thickness of each layer of copper foil to be as uniform as possible.     2.   Manufacturing  S tage 1)  Control manufacturing temperature and humidity Heating and coo...

What Causes PCB Warpage?

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       PCB warpage refers to the problem that the substrate appears as a  plane  unevenness during the PCB manufacturing process.  This problem can lead to poor electrical connections, damaged components, signal interference, and more.   Therefore, enough attention should be paid to the problem of PCB boards warpage. So what is the PCB warpage standard? What causes PCB warpage?       I.  PCB Warpage Standard The PCB industry attaches great importance to the problem of PCB warpage, so it also stipulates some warpage standards and clarifies the specific numerical requirements for warpage. The current standard for PCB warpage is mainly the IPC-6012 specification.     The IPC-6012 specification is a general specification adopted by the PCB industry, which mainly stipulates the following standards: 1) Single   sided or double   sided  board s cannot exceed 0.75% of the size; 2) Multi-layer boards cannot exce...