Why are Ceramic Substrates Made by DPC Technology More Expensive than Those Made by DBC Technology
DPC(Direct Plating Copper) technology and DBC(Direct Bond Copper) technology are two commonly used ceramic substrate manufacturing technologies. While they are both method for manufacturing ceramic substrate, there are some important differences between them that make the DPC technology more expensive than the DBC technology. 1. Definition DPC Technology : It refers to a technology of plating copper directly on the ceramic surface. It can be achieved by electroplating or hot plating . DBC Technology: It refers to a technology that directly combines copper and ceramics. It is usually made by adding oxygen element between copper and ceramics , followed by chemical metallurgical bonding. 2. Advantages DPC Technology: 1) The temperature of magnetron sputtering technology is below 300°C, completely avoiding the adverse effects of high tempera...