博文

目前显示的是标签为“Dispensing Technology”的博文

How to Solve the Defects of PCB Dispensing Technology

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In the PCB production process, sometimes there will be defects such as wire drawing, glue nozzle clogging, empty extrusion, and  component displacement . So what is the cause of the defect? How to solve these defects?       1.  Wire drawing  / trailing R eason:   Wire drawing /tailing is a common defect in dispensing.   The common reasons for it are that the inner diameter of the glue nozzle is too small, the dispensing pressure is too high, the distance between the glue nozzle and the PCB is too large, the patch glue is expired or the quality is not good, the viscosity of the patch glue is too high, and it cannot return to room temperature after being taken out of the refrigerator, too much glue dispensed, etc.   Solution: For the above reasons : 1)  R eplace the nozzle with a larger inner diameter ; 2)  Reduce dispensing pressure; 3)  Adjust the "stop" height; 4)  Change the glue and choose the glue type with suitable vi...

3 Dispensing Paths for Dispensing Technology

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        PCB are sometimes processed by dispensing machines, which are mainly used for waterproof, dustproof, anticorrosion, and long-term effective protection of PCB and some electronic components that are sensitive to some electronic equipment. In the dispensing process, there are 3 dispensing paths. Do you know which 3 are?       1.  I-shaped Distribution Path The I-shaped dispensing path, also known as the straight-line dispensing path, is suitable for dispensing where a small area is required at the edge of the chip. The length of the dispensing route is generally 50% to 125% of the edge length of the chip. Longer lines can help reduce the curing time of the glue at the edge of the chip, but increase the possibility of trapping some air bubbles, so care needs to be taken to control the amount of glue used.     2.  L-shaped  D ispensing  P ath The L-shaped dispensing path is dispensing along the adjacent two sides of th...