Difference between Rolled Copper and Electrolytic Copper in FPC
With the rapid development of electronic technology, FPC is used more and more widely in electronic products. The substrate of FPC is its key component, and the type of copper foil in the substrate has an important influence on the performance of FPC. The commonly used copper foils include rolled copper and electrolytic copper. There are significant differences between the two in manufacturing process and performance characteristics. Do you know what the difference is? I. Differences in Manufacturing Method 1. Rolled Copper: It laminates high-purity (>99.98%) copper onto the FPC by rolling. The reason for this is that the FPC has excellent adhesion to the copper foil, and the copper foil has high adhesion and operating temperature, and can be dip-soldered in 260 ° C tin liquid without blistering. The thinnest can be up to 1 mil (industrial unit: mil, which is one thousandth of an inch, equivalent to 0.0254mm ). 2. Ele...