How to Solve the Defects of PCB Lamination Technology
In the PCB manufacturing process, the lamination technology is the most important step. Some quality defects may occur during this process, which will affect the quality of the final PCB product. So what causes the defects? How do we solve these defects? 1. After the lamination of multi-layer boards is completed, if chronic misalignment occurs, it is not in the board material parts of the inner layer boards. Reason 1: The positioning pin is too short and the position is inaccurate. Solution: Use longer plugs instead. Reason 2: The small size of the positioning pin causes looseness with the positioning hole of the base material. Solution: ①Replace with ne w pin s. ②Trim the problematic positioning pin. Reason 3: Regarding the position of the tooling hole, the circular shape of the inner film has been aliased. Solution: ① First put the inner films together, then...