What is the Difference between Multilayer PCB Browning and Black Oxide Removal
Multilayer PCB can realize more connections and functions in a small area. In the multilayer PCB manufacturing process, browning and black oxide removal are common manufacturing technologies, so do you know the difference between these two technologies? Let's first understand the effects of browning and black oxide removal of multilayer PCB - R oughe n the copper surface, increas e the bonding area, and increas e the surface bonding force. 1. Black Oxide Removal 1) Process: PCB Board In → Cleaning Solder Mask → Water Rinsing →Microetching→ Water Rinsing → Black Oxide(First) → Water rinsing → Microetching → Pre-dip → Black Oxide(Second) → Water Rinsing → Baking → PCB Board Out 2) Advantages: The bonding force of the black oxide removal technology is better than that of the browning technology. 3) Disadvantages: The black oxide removal technology wil...