Five Methods to Remove PCB Tin Slag
In the PCB manufacturing process, solder paste or tin wire is usually used to solder components on the PCB in order to achieve circuit connection and electrical performance. However, during the PCB manufacturing and assembly process, there will inevitably be waste and residue of solder paste or tin wire, and these excess tin slag will have a negative impact on the performance and reliability of the PCB. So how to remove excess tin slag on PCB? 1. Manual Removal Method Manual removal is a simple and primitive method of removal. It is primarily done manually, using hand tools to remove excess tin slag. For example: scraper, brush, spray gun, etc. Advantages: Simple and easy to operate, no equipment and materials are required, only operators with certain skills and experience are required. It can also be personalized for different PCB and tin slags, with high flexibility and plasticity. Disadvantages: ...