The Difference Between 2 Types of PCB Laser Via Forming
In PCB factories , infrared laser and ultraviolet laser via forming technologies have their own characteristics. The following are the differences between these two PCB laser via forming technologies in PCB manufacturing: Infrared laser: 1. When the heating temperature reaches the melting point of the material, the material will melt. If the laser energy is large enough, the material will be vaporized to form via s. 2. Infrared laser can melt and vaporize resin and glass cloth to form vias, but it cannot form vias in copper foil. So, if a substrate with copper foil on the surface is drilled using infrared laser, the copper foil at the location to be laser drilled needs to be removed in advance to form a drilling point. These laser drilling points are usually produced by photoinduced pattern transfer etching technology. U ltraviolet L aser: 1. The principle of UV laser is to use ...