How to Solve the Defect of Reflow Soldering Technology
During the reflow soldering technology , PCB will encounter soldering defects for various reasons. So what is the cause of the defect? How to solve these defect? 1. Tombstone Phenomenon In reflow soldering, chip components often stand up, which is called tombstone. This is a defect that often occurs in reflow soldering technology. Cause: The wetting force on the both sides of the component is unbalanced, so the moment on both ends of the component is also unbalanced, resulting in the occurrence of tombstoning. The following situation will cause the wetting force on the both sides of the component is unbalanced: 1) Pad design and layout are unreasonable. 2) Solder paste and solder paste printing is uneven. 3) Patch displacement. 4) The furnace temperature curve is not set correctly. Solution: 1) Improve pad design and layout. 2) Choose a solder p...