PCB Blogger-China PCB Factory,HOYOGO

Vias are one of the important components of multilayer PCBs. The cost of drilling usually accounts for 30% to 40% of PCB manufacturing costs. Simply put, each hole on the PCB can be called a via.   First:  Parasitic  C apacitance of  V ia The via itself has a parasitic capacitance to ground. If the diameter of the isolation hole of the via on the ground layer is known to be D2, the diameter of the via pad is D1, and the thickness of the PCB board is T, and the dielectric constant of the board substrate is  ε , the parasitic capacitance of the via hole is approximately: C = 1.41 ε TD1/(D2-D1).   The main effect of the parasitic capacitance of the via on the circuit is to extend the rise time of the signal and reduce the speed of the circuit. For example, for a PCB with a thickness of 50Mil, if a via with an inner diameter of 10Mil and a pad diameter of 20Mil is used, and the distance between the pad and the ground copper area is 32Mil, then we can approximate the via through the above f

As a part of the whole machine, the circuit board usually cannot constitute an electronic product, and there must be external connection problems. For example, electrical connections are required between circuit boards, between circuit boards and off-board components, and between circuit boards and equipment panels. Choosing the best matching connection for reliability, manufacturability and economy is one of the important steps in circuit board design. There are many external connection methods, and it is necessary to flexibly choose according to different characteristics.   Circuit  B oard  I nterconnection  M ethod 1:  S oldering  M ethod The advantages of this connection method are simple, low cost and high reliability, which can avoid failures caused by poor contact. The disadvantage is that it is not easy to exchange and maintain. This method is usually suitable for the case of few external leads.   1.  PCB wire soldering This method does not require any connectors, as long as th

Electronic equipment needs high performance, high speed, thin, light and short, and PCB is a multidisciplinary industry and the most critical technology for high-end electronic equipment. The rigidity, flexibility, rigidity-flexibility of multi-layer boards in PCB products, as well as the module substrates used for IC packaging substrates, have made great contributions to high-end electronic equipment.     From the current PCB technology, we can see the following five development trends: First:  Development along the path of high-density interconnect technology (HDI) Since HDI embodies the most advanced technology of contemporary PCBs, it can bring thin lines and small apertures to PCBs. Among HDI multilayer board application terminal electronic products, mobile phone is the model of HDI frontier development technology. In the fine wires of the PCB motherboard in mobile phones, the wire width/spacing has become mainstream. In addition, the thickness of the conductive layer and the boar

Circuit board design is a crucial part of the entire circuit board production, whether it is the design trend, the choice of ground point, the layout of power filter / decoupling capacitor, the line diameter, and the number of vias, solder joints and line density, these five key The point determines the final structure of the circuit board and the application quality.     1. Have a reasonable Direction Such as input / output, AC / DC, strong / weak signal, high frequency / low frequency, high voltage / low voltage, etc.     2. Choose a good ground point: the ground point is usually the most important  We do not know how many engineers and technicians discussed this small ground point, which shows its importance. Due to various limitations, it is difficult to find a good grounding point, but you should try to follow it. This question is very flexible in practice. Everyone has their own set of solutions, which can be easily understood if it can be explained for a specific circuit board.