PCB Blogger-China PCB Factory,HOYOGO

  Generally speaking, the more complex the functions of electronic products, the longer the loop distance, the more contact pins, and the more layers the PCB needs. The substrate of the circuit board itself is made of an insulating and non-flexible material. The tiny circuit material that can be seen on the surface is copper foil. The copper foil was originally covered on the entire board, but part of it was etched away during the manufacturing process, and the remaining part became reticular fine lines. These wires are called wires or routing and are used to provide circuit connections for components on the PCB. In order to fix the part on the PCB, we solder its pins directly on the wiring. In the most basic single panel, the parts are concentrated on one side, and the wires are concentrated on the other side. In this way, we need to make holes in the board so that the pins can pass through the board to the other side, thereby soldering the pins of the part to the other side. Because

  In the PCB layout process, after completing the system planning, the PCB diagram should be checked to see whether the system planning is reasonable and whether the best results can be achieved.  1. System planning ensures whether the wiring is reasonable or optimal, whether the wiring can be carried out reliably, and whether it can ensure the reliability of circuit operations. When planning, it is necessary to have an overall understanding and planning of the direction of the signal and the power and ground wire network. 2. Whether the size of the circuit board matches the size of the processing drawings, whether it can meet the technical requirements of PCB production and whether there are behavior symbols. It is important to note that the circuit planning and wiring of many PCB boards have been carefully planned and reasonably designed, but the precise positioning of the positioning connectors has been ignored, resulting in the planned circuit cannot be connected to other circuits.

  I. Enhance the ability of PCB to resist deformation The deformation of the circuit board is usually comes from rapid thermal expansion and contraction caused by high-temperature reflow, coupled with uneven distribution of parts and copper foil on the circuit board, which will aggravate the deformation of the circuit board. The methods to increase the resistance to deformation of the circuit board are: 1. Increase the thickness of the PCB circuit board. If possible, it is recommended to use a circuit board with a thickness of 1.6mm or greater. 2. Use high Tg PCB material. 3. Pour glue on the circuit board. You can also consider pouring glue around the BGA or the back of the corresponding circuit board to enhance its stress resistance. 4. Add reinforcement around the BGA. If there is space, you can consider building a supporting iron frame around the BGA to strengthen its ability to resist stress, just like building a house. II. Reduce PCB deformation Generally speaking, when the circu

For electronic equipment, a certain amount of heat is generated during operation, which causes the internal temperature of the equipment to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, components will fail due to overheating, and the reliability of electronic equipment will decrease. So, the heat dissipation of te circuit board is very important. 1. Add heat-dissipating copper foil and copper foil with large area power supply. 2. Thermal vias can effectively reduce the junction temperature of the device, improve the uniformity of the temperature in the thickness direction of the single board which provide the possibility to adopt other heat dissipation methods on the back of the PCB. Through simulation, it is found that the thermal index of the device is 2.5W, the spacing is 1mm, and the 6x6 thermal vias in the center can reduce the junction temperature by about 4.8℃, and the temperature difference between the top and bottom of the PCB is