Cause Analysis of Soldering Defects in PCBA Processing
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO., LTD. specializes in providing overall PCBA electronics manufacturing services, including one-stop services from upstream electronic component procurement to PCB production and processing, SMT patch, DIP plug-in, PCBA testing and finished product assembly. The following is an introduction to everyone: the common causes of soldering defects in PCBA processing. 1. The solderability of the board hole affects the sol d er ing quality The poor solderability of the circuit board holes will cause PCBA processing and soldering defects, which will affect the parameters of the components in the circuit, resulting in unstable conduction between the components and the inner layer of the multilayer board, and the entire circuit function will fail. The so-called solderability refers to the property that the metal surface is wetted by molten solder, that is, a relatively uniform, continuous and smooth adhesive film is formed on the metal surface of