博文

目前显示的是 一月, 2021的博文

Cause Analysis of Soldering Defects in PCBA Processing

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  SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO., LTD. specializes in providing overall PCBA electronics manufacturing services, including one-stop services from upstream electronic component procurement to PCB production and processing, SMT patch, DIP plug-in, PCBA testing and finished product assembly. The following is an introduction to everyone: the common causes of soldering defects in PCBA processing. 1.  The solderability of the  board  hole affects the  sol d er ing quality     The poor solderability of the circuit board holes will cause PCBA processing and soldering defects, which will affect the parameters of the components in the circuit, resulting in unstable conduction between the components and the inner layer of the multilayer board, and the entire circuit function will fail. The so-called solderability refers to the property that the metal surface is wetted by molten solder, that is, a relatively uniform, continuous and smooth adhesive film is formed on the metal surface of

The Composition of the PCB Circuit Board

  The component of the PCB circuit board: PCB are similar to layered cake or lasagna, with alternating layers of different materials that are laminated together by heating and adhesive to from a single object. FR4:  Base material is fiberglass. In historical, the most common sign of this fiberglass is "FR4". This rugged core gives the PCB rigidity and thickness. Perf Board:  Other materials (such as epoxy resin or phenolic resin) will be used to make cheaper PCBs and perf boards, which are not as durable as FR4, but are much cheaper. When you are using this type of PCB, soldering it will have a very bad smell. This type of substrate is usually used in low-end consumer electronic products. PCB copper   expo sure , no solder mask or  silk screen printing :  The next layer is a thin copper foil, which is laminated to the board by heating and adhesive. On a normal double-sided PCB, copper is applied to both sides of the substrate. In lower-cost electronic products, the PCB may ha

PCB Changes after SMT

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  After PCB soldering the component, it is called PCBA. PCB has no function, it can only function with the circuit after smt. PCB raw material: copper clad laminate is the base material for manufacturing printed circuit boards. In addition to supporting various components, electrical connection or electrical insulation between them can also be achieved. In short, it is a thin board containing integrated circuits and other electronic components. It will appear in almost every electronic device. If there are electronic components in a certain device, they are all mounted on PCBs of different sizes. In addition to fixing various small parts, the main function of the PCB is to provide electrical connections between the upper parts. What is SMT? SMT is an abbreviation for surface mount technology. SMT is a new generation of electronic assembly technology, and it is also the most popular technology and process in the current electronic assembly industry. It compresses traditional electronic

PCB Development Advantages and Technology Status

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  PCB circuit boards make the circuit miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical layout. 1.  Industrial policy support China should upgrade its electronic information manufacturing industry, and vigorously develop core industries such as integrated circuits, software, and new components in accordance with the overall trend of digitalization, networking, and intelligence. 2.  Downstream industries continue to grow rapidly The rapid development of China's information and electronics industry provides a good market environment for the rapid development of the printed circuit board industry. The continuous increase in the output of electronic communication equipment, electronic computers, household appliances and other electronic products has provided a strong impetus for the rapid growth of the printed circuit board industry. 3.  Labor cost advantage Due to the preferential measures of Asian countr

Causes of Process Problems Caused by PCB Pretreatment

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  The PCB pretreatment process seriously affects the quality of the manufacturing process. Human, machine, materials, and other conditions in the PCB pretreatment program may cause some problems, which need to be analyzed to achieve more effective operation. 1. The process of using pretreatment equipment, such as: inner layer pretreatment line, electroplating-copper pretreatment line, D/F, solder mask... etc. 2. Gold steel brushes with #600 and #800 brush wheels are usually used, which will affect the roughness of the circuit board surface, the length of the ink and the adhesion of the copper surface. However, if the brush wheel is used for a long time, if the product is not placed on the left and right sides, the phenomenon of dog bones is likely to occur. This will cause the circuit board surface to be rough and uneven, line distortion, and the color difference between the copper surface and the INK after printing is different, so a complete painting operation is required. Brush mark