博文

目前显示的是 七月, 2021的博文

How to Set the Processing Parameters of SMT?

图片
In  SMT processing , many processes need to be set the parameters of  the  processing equipment .  However, many detailed parameters cannot be achieved overnight. SMT manufacturers need to sum up experience in long-term practice to process high-quality products.  The setting steps are mainly divided into the following 7 steps:       1.  Graphic alignment Use the printer camera to align the optical MARK point on the stencil on the workbench, and then fine-tune the X, Y,  θ  and other graphics to make the stencil and the stencil pad patterns completely match.     2.  Angle of scraper and st encil The smaller the angle between the  scraper  and the stencil, the greater the downward pressure. The solder paste can be easily injected into the stencil,  and   the solder paste ca n be  squeezed into the bottom of the stencil . The angle between the scraper and the stencil is usually 45-60 degrees.     3.  Scraper force S craper   force is an important factor affecting printing quality.   The p

What Should Professional SMT Factories Pay Attention to When PCBA Processing

图片
With the development of electronic products in a small and precise direction, the size of many SMD components is getting smaller and smaller, not only the requirements of the processing environment are constantly improving, but also higher requirements for the  SMT processing  technology.  To do a good job in  PCBA processing , a professional  SMT factory  must do at least the following  3   points.   1.  Solder paste needs to be used during SMT processing.  After the SMT factory purchases the solder paste, if  they   don't use it immediately,  they   must put it in an environment of 1-10 ° C, instead of placing it in a light-irradiated place or storing it in an environment below 0 ° C!   This is to ensure that the quality of the solder paste does not affect subsequent use.     2.  The SMT factory must check the placement machine equipment frequently.  If the equipment is aging, or some parts are damaged, the equipment must be repaired or replaced with new equipment in time.  This

How Can SMT Factories Improve SMT Processing Efficiency?

图片
SMT proce ssing  is a very critical process in today ’ s electronics manufacturing process. Now more and more PCBs are produced and widely used. SMT assembly manufacturing involves many complex processes. In SMT processing, efficiency is of the utmost importance. How can the SMT factory improve the SMT processing efficiency?   1.  Choose components of the same type Components play a very important role in the efficiency of SMT processing. They are used to manufacture the entire PCBA to achieve electrical function connectivity. If you choose a component manufacturer, it is best to choose the same one, because not all manufacturers can produce the same components. The size, shape, and function of components produced by different manufacturers may be different, and it is difficult to perform efficient processing with complex and diverse categories.  In the process of patch processing, the fewer types of components, the better, the more uniform the brand model, the better, if there is any

Top 10 Tips for PCB Routing

图片
        PCB routing   is to lay out printed wires according to the PCB circuit schematic diagram, wire table, and the required wire width and spacing. The routing should generally comply with the following rules:       1.  The PCB routing should be as simple as possible on the premise of meeting the requirements of use. The order of selecting the routing method is single layer - double layer - multilayer.     2.  The wire layout between the two patch connection plates should be as short as possible, and sensitive signals and small signals should go first to reduce the delay and interference of small signals. Ground shielding should be designed near the input line of the analog circuit; t he wiring of the same layer should be evenly distributed ; the conductive area on each layer should be relatively balanced to prevent PCB warping during processing.     3.  When changing the direction of the signal line, a diagonal or smooth transition should be taken, and the radius of curvature shoul

Reasons for Using Flexible PCB in Medical Device

图片
Nowadays, medical device has become more and more intelligent and versatile, and the electronic systems in it have become more complex. Many devices have become miniaturized, and the size of their circuit boards has also shrunk.  Flexible PCBs  also play an important role in medical device, but why are flexible PCBs widely used in medical device?       1. Insulating substrate Flexible PCB is made of insulating substrate. It can provide excellent electrical performance, and it will be more needed for smaller and higher-density electronic products, and it is more in line with the design needs of the installation of these small and high-density electronic products.     2. Dynamic bending The flexible PCB can be freely bent, wound and folded, and can withstand millions of dynamic bending without damaging the wires. This feature helps medical devices that expand, contract, or retract during the application process to stay connected.     3. Biocompatibility The materials used in flexible PCB

The Advantage of Ceramic PCB Laser Processing

图片
With the development of  ceramic PCB  laser processing technology, equipment and process, it has been widely used in many fields.   The probability of thermal deformation of the workpiece during processing is extremely small, and the subsequent processing efficiency is extremely high, and it is easy to realize automation.   So what are the specific advantages of laser processing technology?   1. The laser power density is high, and the temperature of the workpiece rises rapidly after absorbing the laser, causing  melting  or vaporiz ing .  Even materials with high melting point, high hardness and brittleness can be processed by laser.     2.  If there is no contact between the laser head and the workpiece,   there is  no problem of abrasion of processing tools .     3.  Moving workpieces or materials sealed in the glass shell can be processed .     4. The divergence angle of the laser beam can be less than 1 milliarc, the spot diameter can be as small as microns, and the action time ca