What are the Main Differences Between HASL and Immersion Tin?
HASL and immersion tin are common surface treatment processes for PCB, both are used for lead-free soldering. Do you know the difference between the two? 1. Technological Process HASL: Pretreatment → HASL → Testing → Profile → Visual Inspection. Immersion Tin: Testing → Chemical Treatment → Immersion Tin → Profile → Visual Inspection. 2. Technological Principle HASL is mainly to immerse the PCB directly into the molten tin paste . After being leveled by hot air, a dense tin layer will be formed on the copper surface of the PCB. The immersion tin mainly uses displacement reaction to form a very thin tin layer on the PCB surface. 3. Physical Property The thickness of the HASL tin layer is about 1um-40um, the surface structure is relatively dense, the hardness is large, and it is not easy to scratch. HASL only uses pure tin in the production process, so the surface is easy to clean, it can be stored at normal temperature for one year, and the problem of surface