PCB Blogger-China PCB Factory,HOYOGO

       The circuit board is made of copper clad laminate with a layer of copper foil on both sides of the copper clad laminate. When the thickness of the copper foil is greater than or equal to 2OZ, it is defined as a   thick copper board , so why do we make such thick copper, and what are the characteristics of the thick copper board?       1.  C arry  H igh  C urrent In the case of a certain line width, increasing the copper thickness is equivalent to increasing the cross-sectional area of the circuit, so the thickening of the copper foil can make the circuit board carry a larger current.     2.  R educe  T hermal  S train The conductivity of copper foil is small   (conductivity is resistivity; metal conductors are divided into: silver  →  copper  →  gold  →  aluminum  →  tungsten  →  nickel  →  iron.).  In the case of passing a large current, the temperature rise  of the copper foil  is  very  small, so the thick copper  board  can reduce the heat generation, thereby reducing the th

       According to JPCA-ES-01-2003 standard: Copper clad laminates with chlorine (C1) and bromine (Br) contents less than 0.09% Wt (weight ratio) respectively (at the same time, the total amount of CI+Br  ≤  0.15% [1500PPM]) are defined as halogen-free copper clad laminates.  So what are the characteristics of halogen-free PCB?   1.   Environmental  P rotection Halogen-free PCB  board realizes environmental protection and non-toxicity of PCB by replacing or replacing harmful elements.     2.  F lame  R etardant Most of the halogen-free materials are mainly phosphorus -based   and phosphorus - nitrogen -based .   The polymer resin containing phosphorus and nitrogen compounds will form a carbonized film when it is burned, which can isolate the burning surface of the resin from contact with the air, so that the fire can be extinguished and the flame retardant effect can be achieved.     3.   G ood  I nsulation Halogen-free PCB uses phosphorus or nitrogen instead of halogen atoms, which r

In the PCB production process, the purpose of surface treatment is to ensure good solderability or electrical properties, so it is one of the important steps.  At present, the common surface treatment methods on the market include spray tin, immersion tin, immersion gold, etc. It is relatively rare to use ENEPIG for surface treatment. What is the PCB ENEPIG  technology ?   ENEPIG is a chemical palladium slot between chemical nickel and chemical gold.  Compared with other surface treatment methods,  ENEPIG   has the advantages of stable durability, excellent solder resistance, good compatibility, high plating flatness, and suitable for high-density pads, so it can be used in more precise PCB.   The welding performance is also better.     At present, the most widely used immersion gold  technology   is to wrap a layer of nickel-gold alloy on the copper surface to protect the PCB for a long time.   Compared with immersion gold, ENEPIG can prevent the corrosion phenomenon caused by the rep

       BGA packaging is  now  he mainstream packaging method. It has many advantages. Do you know what they are?       1 . Small size The BGA package only has chips, interconnect lines, thin substrate s   and plastic cover s ,  with   few exposed components and no large pins. The height of the entire chip on the PCB can be 1.2 mm.     2.  Large  S torage  S pace Compared with other types of packaging technologies, memory products and operating products using BGA packages will increase by more than 2.1 times in terms of memory capacity and operating speed.     3.  High  S tability Since the pins of the BGA package are directly extended from the center of the chip to the surrounding s , the transmission path of various signals is effectively shortened, the attenuation of the signal is reduced, the response speed and anti-interference ability are improved, and  the stability of the product is increased .     4.   Facilitate  R epair The pins of the BGA package look neatly arranged at the