PCB Blogger-China PCB Factory,HOYOGO

       The industrial control motherboard is an important part of the industrial control computer. The quality of the industrial control motherboard determines whether the industrial control computer can run for a long time. So how to distinguish the quality of the industrial control motherboard?       1.  M otherboard  M aterial The quality of the industrial control motherboard can be judged by the materials used.   The materials used for industrial control motherboards include capacitors, inductors, switch buttons, Debug lights, BIOS, etc. Among them, the number of power supply phases of the CPU on the motherboard is an important indicator for judging. Generally, the more phases, the higher the power supply, the more stable the current, and the smaller the voltage fluctuation. And generally, the more power supply phases the CPU has, the more corresponding inductors and capacitors. Therefore, the number of power supply phases is an important indicator for judging the quality of indust

       In the PCB processing process, in order to save costs and improve production efficiency,  the PCB is usually spliced in the PCB manufacturing link, that is to say, multiple PCB are spliced on a substrate. After the assembly work is completed, the PCB needs to be spliced for subsequent testing, packaging and other work.   So what are the methods of PCB splitting?       1. Manual  Splitting Board Manual splitting board is mainly divided into manual splitting and shears board cutting pliers.  Manual splitting board is the operator manually breaking, folding and other actions to separate the panel boards.  Cutting pliers and dividing the board is to cut the board with the help of cutting pliers. Manual splitting board was the main splitting board method in the past, but due to the excessive stress caused by manual work during splitting board, the PCB was damaged. Therefore, with the popularization of the application of splitting board machines, the manual splitting board method has

       Due to cost and technical reasons, FPC sometimes has failure problems during production and application.  In order to find out the cause of the failure and find a solution to the problem, the FPC factory must conduct a failure analysis on the failure case. So how to find out the cause of FPC failure?       First of all, the FPC factory should pass information collection, functional testing, electrical performance testing, and simple visual inspection to determine the failure location and failure mode of the FPC.     Next, it is necessary to analyze the failure mechanism, that is, use various physical and chemical means to analyze the mechanism that leads to FPC failure or defects, such as virtual welding, pollution, mechanical damage, moisture stress, medium corrosion, fatigue damage, stress overload, etc.     Then, the cause of failure analysis is carried out, that is, to find the cause of the failure mechanism.  Generally, the test verification should be carried out as much as

       PCBA factory will encounter some special components during processing, such as moisture sensitive components. The impact of such components on processing is no less than ESD, so it is necessary to strengthen the storage and use management of moisture sensitive components. So how should PCBA factories correctly handle moisture sensitive components?       PCBA factories can store moisture sensitive components reasonably to avoid damage to components due to moisture absorption of moisture sensitive components. Therefore, the defect rate of the product can be reduced, and the reliability of the product can be improved.     In actual processing, for moisture sensitive components that are affected by moisture are generally baked according to the baking conditions in the warning label on the original packaging bag of the manufacturer. For component manufacturers who do not have corresponding requirements, it is recommended to use high-temperature baking. For component manufacturers who

      Whether it is an ordinary computer or an industrial computer, the motherboard is the ir   core component.   The industrial control motherboard has a wider range of applications and a more complex environment. What requirements do industrial control motherboards need to meet during use?       1. Because industrial personal computers have different operating systems, it is necessary to provide X86 industrial control motherboards or ARM industrial control motherboards according to customer needs. In addition, in order to meet the requirements of the environment, the industrial control motherboard has fixed specifications and sizes, which also needs the choose different sizes of the industrial control motherboards according to the needs of customers.     2. The industrial environment is relatively complex, and generally runs continuously for a long time. Therefore, the industrial control motherboard needs to meet the requirements of long-term stable high-load operation, strong protec

       In the production of FPC factories, only by ensuring higher quality and more stable use effects can they be recognized by consumers. So what are the methods of FPC Factory quality control?       1. Stable and permanently engineered processes as the basis for production The production of FPC needs to be based on a certain process and a perfect production process.   FPC factory   need a complete design process and precise design scheme   during production .   Before the  scheme   is determined, professionals will conduct all-round discussions to ensure the reliability of the  scheme , and it will not be easily adjusted after the  scheme   is established, so the quality of each product can be guaranteed to be stable.     2. Precise control of the production process The production quality of FPC will be affected by the actual production process. Therefore, when the FPC factory is in production, it will integrate the actual production situation and various problems that may be encoun

  The PCB solder mask is a heat resistant coating material that can be applied to selected areas to prevent solder from depositing during subsequent soldering. The solder mask material can be liquid or dry film; it is also very effective in preventing surface damage of the PCB during PCB assembly operations.     If the test point, ground pad or even the component pins are accidentally stained with a solder mask, these are commonplace. However, it does not mean that these PCBs are definitely scrapped. There are several safe and reliable methods for removing the solder mask on the PCB surface: scraping, milling, micro-grinding and chemical stripping; each method has its own advantages and disadvantages.     Scraping This method is not peculiar and has large noise. A skilled technician typically removes the solder mask from unwanted areas with a knife, scraper or chisel. This technology is easy to control and requires no special settings. However, if the removal area is large, the operato

  At present, there are three main types of PCB potting adhesive, namely polyurethane potting adhesive, epoxy resin potting adhesive, and silicone potting adhesive. Each has its own advantages and disadvantages, so how do we choose the potting adhesive in the process of preparing the   PCB ? (1)Polyurethane Potting Adhesive The temperature requirement does not exceed 100 degrees Celsius. After the potting, there will be many bobbles. The potting conditions are under vacuum and the adhesion is between epoxy and silicone. Advantages:  Good low-temperature performance, shockproof performance is the best of the three. Disadvantages:  Poor high temperature resistance. After curing, the surface of the colloid is not smooth and the toughness is poor. The aging resistance and UV resistance are weak, and the colloid is easily discolored. It is suitable for potting low electrical heating indoor electrical components. (2)Epoxy Resin Potting Adhesive Advantages:  It has excellent high temperature

      FPC cable refers to a group of connecting wires that can be bent to a certain extent. Its base material is generally rolled copper, and its function is to connect two related parts or products. So what are the advantages and disadvantages of FPC cables?       Advantages: The use of FPC cables can greatly reduce the volume and weight of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC cables have been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDA, digital cameras and other fields or products. In addition, it can be arranged arbitrarily according to the requirements of the spatial layout, and can be moved and expanded arbitrarily in the three-dimensional space, so as to achieve the integration of component assembly and wire connection.     Disadvantages: In the process of producing FPC products in the FPC fa