PCB Blogger-China PCB Factory,HOYOGO

      Ceramic PCB is to combine copper foil and ceramic substrate by bonding in a high temperature environment. In this way, the bonding force is strong, not only the copper foil will not fall off, but also the reliability is high, and various performances are still stable in the environment of high temperature and high humidity. So what are the materials of ceramic PCB? What are the reasons for using this material?       1.  A luminium  O xide  ( Al 2 O 3 ) A luminium  O xide  is a commonly used material in ceramic PCB, because it has better mechanical, thermal and electrical properties than other ceramic materials, good stability, and rich sources of raw materials, so it is suitable for a variety of technical manufacturing and different shapes. In addition, attention should be paid to the content of aluminum oxide, although the electrical properties are hardly affected, the changes of mechanical property and thermal conductivity a...

       In PCB processing, the patch adhesive has strong adhesion to the metal end, and the cured adhesive layer has good water resistance, oil resistance, high temperature resistance, and aging resistance. Do you know what its curing process is?   There are different types of patch adhesives and different curing processes.   There are two commonly used curing processes - thermal curing and light curing.       1.  PCB  H eat  C uring The curing process of epoxy resin patch  adhesive   is thermal curing. It can be thermally cured in two ways, namely, the oven intermittent type and the reflow oven continuous type.     Oven intermittent curing is to add patch adhesive and mount SMD on the designated position of the PCB, and then put it into a constant temperature oven in batches, and then set the temperature and time according to the curing parameters of the SMD adhesive used.   This curing method is simple...

       When the temperature rises to a certain critical value, the PCB substrate will change from a glass state to a rubber state.  The critical value of this temperature is the Tg value, so why use a high Tg PCB, and what are the specific advantages?       1.  H eat  R esistance The high-density mounting technology represented by SMT and CMT makes the PCB more and more inseparable from the high heat resistance support of the base material in terms of small aperture, circuit refinement and thinning. Ordinary Tg boards will soften and deform at high temperatures, while high Tg PCB have better heat resistance and can still maintain excellent physical and mechanical properties under high temperature conditions.     2.  M oisture  R esistance Moisture is destructive to the PCB and can greatly reduce the insulation resistance between conductors . Compared with ordinary PCB, high Tg PCB have better moisture resistance. ...

       The circuit board is made of copper clad laminate with a layer of copper foil on both sides of the copper clad laminate. When the thickness of the copper foil is greater than or equal to 2OZ, it is defined as a   thick copper board , so why do we make such thick copper, and what are the characteristics of the thick copper board?       1.  C arry  H igh  C urrent In the case of a certain line width, increasing the copper thickness is equivalent to increasing the cross-sectional area of the circuit, so the thickening of the copper foil can make the circuit board carry a larger current.     2.  R educe  T hermal  S train The conductivity of copper foil is small   (conductivity is resistivity; metal conductors are divided into: silver  →  copper  →  gold  →  aluminum  →  tungsten  →  nickel  →  iron.).  In the case of passing a large cu...

       According to JPCA-ES-01-2003 standard: Copper clad laminates with chlorine (C1) and bromine (Br) contents less than 0.09% Wt (weight ratio) respectively (at the same time, the total amount of CI+Br  ≤  0.15% [1500PPM]) are defined as halogen-free copper clad laminates.  So what are the characteristics of halogen-free PCB?   1.   Environmental  P rotection Halogen-free PCB  board realizes environmental protection and non-toxicity of PCB by replacing or replacing harmful elements.     2.  F lame  R etardant Most of the halogen-free materials are mainly phosphorus -based   and phosphorus - nitrogen -based .   The polymer resin containing phosphorus and nitrogen compounds will form a carbonized film when it is burned, which can isolate the burning surface of the resin from contact with the air, so that the fire can be extinguished and the flame retardant effect can be achieved.     3. ...

In the PCB production process, the purpose of surface treatment is to ensure good solderability or electrical properties, so it is one of the important steps.  At present, the common surface treatment methods on the market include spray tin, immersion tin, immersion gold, etc. It is relatively rare to use ENEPIG for surface treatment. What is the PCB ENEPIG  technology ?   ENEPIG is a chemical palladium slot between chemical nickel and chemical gold.  Compared with other surface treatment methods,  ENEPIG   has the advantages of stable durability, excellent solder resistance, good compatibility, high plating flatness, and suitable for high-density pads, so it can be used in more precise PCB.   The welding performance is also better.     At present, the most widely used immersion gold  technology   is to wrap a layer of nickel-gold alloy on the copper surface to protect the PCB for a long time.   Compared with immersion gold, EN...

       BGA packaging is  now  he mainstream packaging method. It has many advantages. Do you know what they are?       1 . Small size The BGA package only has chips, interconnect lines, thin substrate s   and plastic cover s ,  with   few exposed components and no large pins. The height of the entire chip on the PCB can be 1.2 mm.     2.  Large  S torage  S pace Compared with other types of packaging technologies, memory products and operating products using BGA packages will increase by more than 2.1 times in terms of memory capacity and operating speed.     3.  High  S tability Since the pins of the BGA package are directly extended from the center of the chip to the surrounding s , the transmission path of various signals is effectively shortened, the attenuation of the signal is reduced, the response speed and anti-interference ability are improved, and  the stability of the...