Common Problems and Solutions for PCB Dry Film Lamination

Do you know the characteristics of dry film in the PCB industry?

 

1. It has a higher resolution. Generally, the line width can be 4mil;

2. Dry film is used in pattern electroplating process, and electroplating is carried out between the high and vertical clamping walls. hen the thickness of the plating layer is less than the thickness of the resist, the plating layer can be prevented from protruding, and the resist is prevented from being embedded under the plating layer when the film is removed, thereby ensuring the accuracy of the circuit;

3. The thickness and composition of the dry film are consistent, which can avoid discontinuities in the imaging process and has high reliability.

4. The application of dry film greatly simplifies the PCB manufacturing process, which is conducive to the realization of mechanization and automation.



The function of laminated dry film is to adhere the dry film to the rough copper surface. The film laminating machine attaches the dry film to the copper surface by pressing while tearing off the protective film on one side. In the PCB manufacturing process, PCB dry film technology usually encounters some failures. But below we introduced some common problems and solutions when sticking film on PCB.



1. The dry film cannot adhere firmly to the copper foil


(1) The surface of the copper foil is not clean, with oil stains or oxide layers. Please clean the circuit board surface again and operate with gloves.

(2) The solvent in the dry film solvent evaporates and deteriorates. Please store at low temperature, and do not use expired dry film.

(3) Fast transfer speed and low film lamination temperature. Please change the filming speed and film temperature.

(4) The environmental humidity is too low. Please keep the relative humidity of the production environment at 50%.



2. Air bubbles will appear between the dry film and the surface of the copper foil


(1) The surface of the copper foil is uneven, with pits and scratches. The lamination pressure of the film needs to be increased, and the board transport should be handled gently.

(2) The surface of the heat press roller is uneven, with pits and film drilling dirt. Please pay attention to protect the flat surface of the heat press roller.



3. Dry film wrinkling


(1) The dry film is too sticky, please place the board carefully.

(2) The board is too hot before filming. Please do not set the board preheating temperature too high.



4. Residual glue


(1) The quality of the dry film is poor, please replace the dry film.

(2) The exposure time is too long, please shorten the exposure time.

(3) The developer is invalid, please change the developer.



SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO., LTD. is an international, professional, reliable PCB manufacturer. We have 2 production bases with a monthly production capacity of 500,000 square meters. One-stop PCB product supply and solution. And HOYOGO have a management team with 25 years of average industry experience and reliable quality assurance.

评论

发表评论

此博客中的热门博文

What are the Advantages and Disadvantages of the OSP Technology

图片
     With the continuous development of the electronics industry, there are more and more PCB surface treatment technologies, and each technology has its own merits. OSP is a commonly used surface treatment technology process, what are its advantages and disadvantages?       Compared with other surface treatment technologies, OSP is somewhat different.  It uses a chemical method to produce an organic film on the clean bare copper surface, which acts as a barrier between the copper and the air.   OSP is organic, not  metallic,   and its cost is lower than most surface treatment technologies.     Advantages: With this organic film, it can resist the attack of moisture in the air without being oxidized before welding,  can withstand the test of high temperature, maintain good activity, and has a good tinning ability.  This layer of organic film will not cause damage to the sheet material. It can be easily removed by the solder resist during soldering. It can solder the copper wire and the
阅读全文

What PCBA Problems Can AOI Inspect

图片
        With the development of science and technology, the volume of PCBA is getting smaller and more precise, and some defects in processing cannot be distinguished with the naked eye, so AOI has appeared.  So what PCBA problems can AOI inspect?   The working principle of AOI is to first collect and input parameters such as images, component positions, solder joints and other parameters of the good-quality board.   During the inspection, the instrument automatically scans the circuit board and automatically captures the image, and then compares the collected data with the pre-entered parameters to determine whether the characteristics of solder joints, components and other aspects are consistent. If the data is inconsistent, the d efect  will be flagged through the display for maintenance personnel to repair.     AOI is mainly used to inspect solder paste printing, component placement and soldering. For example: too much or too little solder paste,   solder paste printing offset;  co
阅读全文

The Role of Shield Cover in PCB Design

图片
  SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO., LTD. specializes in providing overall PCBA electronics manufacturing services, and can also provide customers with a full range of value-added services: including SMT assembly, PCB program development, schematic design, PCB layout and routing, Bom list matching, component procurement and other services. Do you know the role of shield cover in PCB design? What is a Shield Cover? The shield cover is an alloy metal cover, which is a vital component to reduce the radiation of the display. It is used in MID or VR products, which can effectively reduce the mutual interference between modules. It is common in the isolation between the main control function module and the power module and the Wifi module. The  P urpose of  S hield  Cover   C lip Generally, there are products that use wireless communication, and shield frames are usually designed on the circuit board to isolate electromagnetic interference (EMI). However, to make the shield frame fun
阅读全文