PCB Blogger-China PCB Factory,HOYOGO

         After the PCB is printed, various electronic components need to be welded to fixed positions as required to form a PCBA with certain functions, and the welding position s  of the components must be accurate and firm. In this step, the factory generally uses wave soldering and reflow soldering, but before performing the soldering operation, the electronic components need to be fixed to the fixed position of the PCB by glue, so the dispensing  technology  needs to be applied . So what are the requirements for the PCB dispensing technology?   1.   D ispensing   Amount The diameter of the glue point should be half of the pad pitch, and the diameter of the glue point after placement should be 1.5 times the diameter of the glue point. This can ensure that there is enough glue to bond the components and avoid too much glue from dipping the pads. The amount of dispensing is determined by the length of dispensing time.  Before the actual dispensing operation, the dispensing parameters

         Recently, major news media have reported that Shenzhen has a lot of  “ AI ” !  What is AI? Its full English name is Artificial Intelligence. Although it sounds a bit far away from daily life, in the city of Shenzhen, it has penetrated into our lives, and you may even pass by AI inadvertently.   For example, let ’ s take a look at this AI sanitation robot named  “ Xiaojie ” .   It cleans the pavement calmly on the streets next to the Central Bookstore. Even though it looks ordinary, it has a lot to offer in the city's cleaning field.   When "Xiaojie" is working, it will move back and forth in the designated area and clean up fallen leaves, paper towels, etc. on the road into the "dust bucket". But don't be fooled by this seemingly bulky "Xiaojie". When encountering arc roads and S-shaped roads, it can also skillfully clean the edges.  Moreover, it is equipped with sensing devices on its front, rear and sides. When a pedestrian walks towards

       In electronic manufacturing field, PCBA E-test fixtures are key equipment to ensure the quality and reliability of circuit boards. It is like the meticulous inspector, holding a magnifying glass in one hand and a wrench in the other, closely inspecting each circuit board. So do you know how to strictly control the quality of PCBA E-test fixture?      1.  Design and Customization of E-test fixtures The design of the PCBA E-test fixture is like a suit tailor-made for each circuit board, ensuring that every test point can be accurately connected. Engineers thoroughly analyzed the functional requirements of the circuit board and made the E-test fixtures cover all key test points and signal paths. This custom design, like putting a custom suit on the circuit boards, allows them to pass all quality tests efficiently and elegantly.     2.  Early  D iagnosis and  P revention of  F aults PCBA E-test fixtures can be said to be experts in  “ knowing problems early ” . It can detect potenti

        Conformal coating is a specially formulated coating used to protect circuit boards and related equipment from environmental erosion. In addition to anti-mildew, anti-salt spray and anti-humid heat, it also has many functions such as dust-proof, anti-aging, insulation, etc., which plays a vital role in enhancing the reliability and service life of PCBA boards. Different coating methods are suitable for different processing scenarios, so what are the ways to coat PCBA with conformal coating?   1.  Spraying Spraying is the main coating method of conformal coating at present, which is divided into manual spraying and machine spraying. Among them, machine spraying belongs to the automatic spraying method, which is automatically sprayed by the machine, which has the advantages of uniform spraying, high efficiency and automatic detection of spraying effect.  The disadvantage is that some blocked corners cannot be sprayed, such as the position under the electronic components, and its c

       Red Glue is a polyolefin compound and an SMT material. It is different from solder paste in that red glue solidifies when heated.  When the freezing point temperature reaches 150 ℃ , the red glue will transform directly from paste to solid.   In the SMT patching process, we often see the application of red glue.  So what are the significant advantages of red glue?   1. High-precision Attachment: The red glue technology can achieve high-precision positioning and attachment of SMT components, thereby ensuring a stable connection between components and PCB board.     2. Strong Adhesion: Red glue has excellent adhesion properties and can effectively fix SMT components on the PCB board, thus improving the mechanical strength and vibration resistance of the product.     3. High Temperature Resistance: Red glue can maintain stable performance in high temperature environments and is not easy to soften or flow, making it suitable for subsequent welding technologies.     4. Prevent Compon

        Wave soldering plays a key role in the PCB assembly process.  Its main function is to effectively connect electronic components to PCB boards through soldering technology.   During the process of using wave soldering, tin connection short circuit may occur. How to prevent this phenomenon?   1. Use  C omponents and PCB with   G ood  S olderability Choosing components and PCB with good solderability can effectively reduce the probability of short circuit in tin connections during wave soldering. This is because good solderability ensures that components and PCB surface coating materials are easier to solder during the soldering process. At the same time, pad size and pad position accuracy can also reduce the possibility of short circuit in tin connections.     2.  Improve the Activity of Flux The main function of flux is to effectively remove oxides on the surface of welding parts, thereby enhancing the wetting performance of the solder and further improving the welding quality.

        Under certain high temperature conditions, the resin melt viscosity of the prepreg is closely related to the lamination  technology  of the PCB board.  Optimizing the matching and coordination between the two can significantly improve the appearance and internal performance of multilayer boards   The lamination of multilayer PCB is mainly controlled by pressure, temperature and time. The entire lamination process can be divided into three stages: preheating, holding and cooling. The preheating stage is the key to ensuring PCB board performance and is also the stage for flexible use of different technology conditions. During the preheating stage, the prepreg resin is softened by heating and gradually transforms into a liquid, viscous, or gel state. At the same time, under heating and pressurization conditions, the resin further penetrates and fills the gaps in the glass fibers to complete the lamination exhaust and achieve the initial bonding between layers.     During the prehe