PCB Blogger-China PCB Factory,HOYOGO

        Whether it is an ordinary computer or an industrial computer, the motherboard is the ir   core component.   The industrial control motherboard has a wider range of applications and a more complex environment. What requirements do industrial control motherboards need to meet during use?   1. Because industrial personal computers have different operating systems, it is necessary to provide X86 industrial control motherboards or ARM industrial control motherboards according to customer needs. In addition, in order to meet the requirements of the environment, the industrial control motherboard has fixed specifications and sizes, which also needs the choose different sizes of the industrial control motherboards according to the needs of customers.     2. The industrial environment is relatively complex, and generally runs continuously for a long time. Therefore, the industrial control motherboard needs to meet the requirements of long-term stable high-load operation, strong protecti

       As the demand for automotive electronic equipment continues to grow, how to improve the reliability and performance of electronic components has become a critical problem. In this regard, ceramic PCBs have gradually become an ideal solution due to their excellent electrical insulation and thermal conductivity, especially their stable performance in high-temperature environments.   Superior  P erformance of   C eramic  S ubstrates Ceramic PCBs usually use ceramic substrate materials such as alumina (Al ₂ O ₃ ) or aluminum nitride (AlN).  Among them, alumina is a common ceramic material with moderate cost, excellent mechanical strength, and outstanding electrical insulation performance. Therefore, it is widely used in various fields including electronic equipment. Aluminum nitride is  highly regarded  for its excellent thermal conductivity and relatively low thermal expansion coefficient, which is particularly suitable for high-power system applications that have a high tolerance

       With the rapid development of electronic technology, FPC is used more and more widely in electronic products. The substrate of FPC is its key component, and the type of copper foil in the substrate has an important influence on the performance of FPC. The commonly used copper foils include rolled copper and electrolytic copper. There are significant differences between the two in manufacturing process and performance characteristics. Do you know what the difference is?   I.  Differences in Manufacturing Method 1. Rolled Copper:   It laminates high-purity (>99.98%) copper onto the FPC by rolling. The reason for this is that the FPC has excellent adhesion to the copper foil, and the copper foil has high adhesion and operating temperature, and can be dip-soldered in 260 ° C tin liquid without blistering. The thinnest can be up to 1 mil (industrial unit: mil, which is one thousandth of an inch,  equivalent to 0.0254mm ).     2. Electrolytic Copper:   It can continuously produce l

       Blind & buried PCB is a high density, high precision printed circuit board. Its special structure and complex technology are widely used in high-end electronic products. If you buy poor quality products, there will be various problems need to be dealt with. So in order to avoid this situation, how should we judge the quality of blind & buried vias in PCB?   1.  Check the diameter, depth and wall thickness of blind vias These aspects of qualified blind  &  buried vias all meet the standard requirements, while unqualified  one s may have quality problems in these aspects .  Such as the hole diameter is too large, the hole depth is not enough, the hole wall is too thin and so on.       2.  Check the piercing quality of blind vias Qualified blind & buried vias should have no burr, no broken edges, and no crack when piercing, while unqualified ones may have these quality problems. These problems may lead to failure of buried blind s in use.     3. Check the plating qu

       Automotive infotainment systems have gradually become a core component of vehicles, not only providing drivers with necessary information, but also greatly improving the driving experience and passenger comfort. In the actual operation of these systems, automotive PCB plays a vital role, but do you know which roles they play?   Infotainment Head Unit: The Hub of Connectivity and Entertainment The infotainment head unit is the core of the in-car entertainment and information system. It integrates multiple functions such as audio, video, Bluetooth and Wi-Fi, providing drivers and passengers with rich entertainment options and convenient connection methods. The application of automotive PCB in infotainment head unit, ensures high-quality video and audio output, supports multiple connection methods, and guara ntees syste m reliability and response speed. Additionally, the infotainment head unit needs to work closely with the in-vehicle computing system and network protocols to achie

       With the continuous development of automobile technology, driving experience and ride comfort have been significantly improved. In this process, PCBs play a crucial role. Automotive PCB are not only core components of the modern vehicle electronic systems, but also greatly enhance user comfort and convenience by supporting the functions of various body equipment.   1.  Door Control and Seat Adjustment As the core component of the car, the door control system includes door opening and closing, locking and power window  lifting   functions. The realization of these functions cannot be separated from the support of automotive PCB. Automotive PCB achieves automatic door opening and closing and smooth operation of power windows through precise control of sensors and motors.     Similarly, seat adjustment systems also rely on the efficient operation of automotive PCB. Whether it is the front and rear adjustment of the seat, the inclination adjustment of the backrest, or the realizatio

If the PCB adopts reflow soldering  process , then the solder needs to be applied to the soldering part before soldering.   The main methods of applying solder to solder parts are the solder paste method, the pre-solder method, and the pre-formed solder method.   1. Solder  P aste  M ethod Applying solder paste evenly to the PCB pad pattern is the most commonly used method in the reflow soldering  process. The purpose is to ensure that the pads corresponding to the SMT components and the PCB achieve good electrical connection during reflow soldering, and have sufficient mechanical strength. There are two methods to apply solder paste: Injection  drop  coating method and printing coating method.  The injection drop coating method is mainly used in the development of new products or the production of small batches of products, and can be operated manually.  Although the speed is slow and the precision is low, it has high flexibility and saves the cost of manufacturing templates.     2.