PCB Blogger-China PCB Factory,HOYOGO

  The ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) technology, is the addition of a layer of palladium between nickel and gold. In the deposition reaction of gold replacement, the electroless palladium layer protects the nickel layer from excessive corrosion by the replacement gold and is well prepared for immersion gold process.     ENEPIG process: Degreasing ---- Microetch ---- Pickling ---- Pre-dip -----Activating Palladium ---- Chemical Nickel (Reduction) ---- Chemical Palladium (Reduction) ---- Chemical Gold (Replacement)     ENEPIG technology is applied to the surface treatment of package substrates. In the ENEPIG process, by controlling the palladium on the nickel layer and controlling the ENIG, accurate deposition thickness and uniformity of the gold layer are obtained to achieve a good contact surface. Through the comparison of wire bonding ability, solderability and aging r...

       With the gradual miniaturization of electronic products, the corresponding PCB size is also slowly decreasing.  If you want to mount enough electronic materials in a limited space, sometimes it is not enough to rely on single-sided placement, and it needs to be achieved by double-sided placement.     Double-sided placement, as the name implies, means that both sides of the PCB need to be mounted.   This technology requires placement one side of the PCB before placing the other side of the PCB.  This placement method can not only utilize the limited space of the PCB, but also ensure the aesthetics and functionality of the PCB.   So what do you need to pay attention to when doing double-sided placement?     1. Electronic components with high heat resistance are mounted first. Because some electronic components cannot withstand two high-temperature soldering, the components that are not resistant to high temperature are usu...

       The tombstoning phenomenon refers to the phenomenon that one end of the electronic component does not touch the pad and stands obliquely upwards or the contact pad is upright during PCBA processing. So how to avoid this phenomenon?       1.  W arm-up  P eriod We should correctly set the technology parameters during preheating.  When the preheating temperature is set low and the preheating time is set short, the probability of melting the solder paste at both ends of the component at the same time will greatly increase, resulting in unbalanced tension at both ends, thus forming a "tombstoning".     2. Pad  S ize When designing chip resistor and capacitor pads, the overall symmetry should be strictly maintained, that is, the shape and size of the pad pattern should be exactly the same to ensure that the resultant force acting on the solder joints on the component is zero when the solder paste melts, so that ...

      PCBA conformal   coating   is a kind of protective coating, which will form a transparent protective film after curing to protect PCBA from environmental erosion.   PCBA  factorie s generally classify the types of PCBA conformal coatings according to the solvent content.       1.  Solvent -based   Conformal  Coating Solvent-based conformal  c oating  is a coating made of organic solvents as a dispersion medium, and it is also the type of conformal  c oatings used most by PCBA  factorie s .   Solvent-based conformal   c oating   has the advantages of good protective effect, cheap price, and easy repair. Its disadvantage is that it contains volatile toxic gases.     The solvent types of solvent-based conformal coatings mainly include hydrocarbon solvents, oxygen-containing solvents and water solvents. 1.  Hydrocarbon solvents are mixtures of materials of different molec...

     With the development of  ceramic PCB  laser processing technology, equipment and process, it has been widely used in many fields.   The probability of thermal deformation of the workpiece during processing is extremely small, and the subsequent processing efficiency is extremely high, and it is easy to realize automation.   So what are the specific advantages of laser processing technology? 1. The laser power density is high, and the temperature of the workpiece rises rapidly after absorbing the laser, causing  melting  or vaporiz ing .  Even materials with high melting point, high hardness and brittleness can be processed by laser.     2.  If there is no contact between the laser head and the workpiece,   there is  no problem of abrasion of processing tools .     3.  Moving workpieces or materials sealed in the glass shell can be processed .     4. The divergence angle of the l...

       ENEPIG   and  plating gold  are relatively special surface treatment  technologi es in PCB.   They all have the characteristics of good welding performance, good reliability and long shelf life, so do you know the difference between the two?       ENEPIG is to deposit a layer of nickel, palladium and gold on the surface of PCB by chemical method.     Plating Gold  is to attach gold particles to the PCB board by electroplating.  Because of its strong adhesion, it is also called hard gold. This technology can improve the hardness and wear resistance of PCB, and can effectively prevent the diffusion of copper and other metals.     The  D ifference between  ENEPIG   and  Plating Gold   1.  ENEPIG technology   does not require  lead design,  and the   design  limitations  are small.  Plating gold technology must have a lead design, ...

      After the PCB is printed, various electronic components need to be welded to fixed positions as required to form a PCBA with certain functions, and the welding position s  of the components must be accurate and firm. In this step, the factory generally uses wave soldering and reflow soldering, but before performing the soldering operation, the electronic components need to be fixed to the fixed position of the PCB by glue, so the dispensing  technology  needs to be applied . So what are the requirements for the PCB dispensing technology?       1.   D ispensing   Amount The diameter of the glue point should be half of the pad pitch, and the diameter of the glue point after placement should be 1.5 times the diameter of the glue point. This can ensure that there is enough glue to bond the components and avoid too much glue from dipping the pads. The amount of dispensing is determined by the length of dispensing time.  B...