PCB Blogger-China PCB Factory,HOYOGO

  Do you know? Whether it is a fully loaded assembled board or a bare board, as long as defects are found during PCB board inspection, cost-effective repair methods must be evaluated. At the same time, it provides users with products with the same reliability as the original products. For simple circuit boards with only a few defects, it is usually uneconomical to reprocess them. However, many circuit boards have a high degree of complexity, and fully loaded boards may be expensive. At this time, it is more economical to reprocess the unqualified product to pass the test. The bare board is usually not repaired because it will bring reliability risks to future assembly and use. Moreover, the price of bare boards is relatively low compared with assembled boards. Based on the above factors, in high reliability and military applications, repair and reprocessing of bare boards is not allowed, and reprocessing of bare boards can only be used for commercial purposes. However, the maintenance

With the rapid development of electronic technology, only by recognizing the development trend of PCB technology can   circuit board manufacturers   actively develop innovative production technologies to find a way out in the highly competitive PCB industry. 1. Develop component embedding technology     Component embedding technology is a huge change in PCB functional integrated circuits. It forms semiconductor devices (active components), electronic components (passive components) or passive components on the inner layer of the PCB with the function "component embedded PCB" and has begun mass production. However, in order to develop circuit board manufacturers, analog design methods must first be addressed. Production technology, inspection quality, and reliability assurance are also top priorities. 2. HDI technology is still the mainstream development direction     HDI technology promoted the development of mobile phones, promoted the development of information processing a

  PCB raw material suppliers are often complained by customers that the copper wire is falling off (also commonly referred to as peel off copper). Once this happens, the PCB factories will say that this is a laminate problem, and then the customers will ask the production factories to bear heavy losses. The common reasons are as follows: I. PCB Factory Process Factors: 1. The copper foil is over-etched. Electrolytic copper foils used in the market are usually single-sided galvanized (usually called ashing foil) and single-sided copper plating (usually called red foil). The common peeling off copper is generally galvanized copper foil above 70um, and the reddish foil and the ashed foil below 18um basically have no mass copper peeled off. Because zinc is inherently an active metal, when the copper wire on the PCB is immersed in the etching solution for a long time, it will inevitably lead to excessive side corrosion of the circuit, causing some thin circuit backing zinc layer to be compl

Do you know the characteristics of dry film in the PCB industry?   1. It has a higher resolution. Generally, the line width can be 4mil; 2. Dry film is used in pattern electroplating process, and electroplating is carried out between the high and vertical clamping walls. hen the thickness of the plating layer is less than the thickness of the resist, the plating layer can be prevented from protruding, and the resist is prevented from being embedded under the plating layer when the film is removed, thereby ensuring the accuracy of the circuit; 3. The thickness and composition of the dry film are consistent, which can avoid discontinuities in the imaging process and has high reliability. 4. The application of dry film greatly simplifies the PCB manufacturing process, which is conducive to the realization of mechanization and automation. The function of laminated dry film is to adhere the dry film to the rough copper surface. The film laminating machine attaches the dry film to the copper

  The circuit board design scheme is based on the circuit schematic diagram to realize the functions required by the circuit designer. The PCB circuit board design scheme mainly refers to the layout design, which needs to consider various factors, such as the layout of external connections, the optimized layout of internal electronic components, the optimized layout of metal connections and through holes, electromagnetic protection and heat dissipation, etc. Excellent layout design can save production costs and achieve good circuit performance and heat dissipation performance. Simple layout design can be realized by hand, while complex layout design needs to be realized by computer-aided design. In high-speed design, the characteristic impedance of the controllable impedance board and circuit is one of the most important and common problems. First understand the definition of a transmission line: a transmission line is composed of two conductors with a certain length, one conductor is

  In printed circuit boards, copper is used to interconnect components on the substrate. Although it is a good conductor material for forming the pattern of the conductive path of the printed circuit board, if it is continuously exposed to the air, it will easily lose its luster due to oxidation and corrosion and lose its solderability. So, various technologies must be used to protect copper printed wiring, vias and plated through holes. These technologies include organic coatings, oxide films and electroplating. The application of organic coatings is very simple, but due to changes in its concentration, composition and curing cycle, it is not suitable for long-term use. It may even cause unpredictable deviations in solderability. The oxide film can protect the circuit from corrosion, but cannot maintain solderability. Electroplating or metal coating processes are standard operations to ensure solderability and protect circuits from corrosion, and play an important role in the manufact

In the circuit board manufacturing process, from technological review to production to final inspection, many aspects of technological work are involved, and the monitoring and control of technological quality and production quality must be considered.   I .  Technological R eview Technological review is based on the original materials provided by the design, in accordance with the relevant "PCB design specifications" and related standards, combined with the actual production, to conduct a process review of the relevant design materials for manufacturing circuit boards provided on the design site. The main points of the technological review are as follows: 1. Whether the design data is complete (including: floppy disk, technical standards for implementation, etc.) 2. Bring up the floppy disk data and conduct a technological inspection, which should include circuit patterns, solder mask patterns, drilling patterns, digital patterns, electrical measurement patterns and related