PCB Blogger-China PCB Factory,HOYOGO

      Due to the existence of water molecules in the air, if the PCB is exposed to the air for a long time, the external moisture may enter the PCB board, and the purpose of baking is to remove moisture, and evaporate the excess moisture in the PCB by heating.       If the content of water molecules in the PCB exceeds the relevant regulations, in the process of high temperature reflow soldering, wave soldering or hand soldering, these internal water molecules will be heated and atomized into water vapor will expand rapidly as temperature rises. The higher the temperature, the larger the atomization volume. When the water vapor cannot escape from the PCB in time, it is likely to expand the PCB, thereby breaking the via holes between the PCB layers, causing the separation of the layers of the PCB. In severe cases, blistering, expansion, and board explosion can be seen from the outside of the PCB.     Sometimes the above problems cannot be seen on the outside of the PCB, but in fact the i

      After the PCBA is processed and welded, some flux residues will remain on the surface. If the surface cleanliness cannot be effectively guaranteed, it may affect the use time of the PCBA, so effectively cleaning the circuit board in manufacturing process is a very important step. So what should we be pay attention to when cleaning the PCBA board?       1.  After the PCBA board is soldered, the flux residue will corrode over time, so it should be cleaned in time after soldering.     2.  When cleaning the PCBA, we must wear an electrostatic wristband and a protective mask.     3.  When cleaning the PCBA, its necessary to protect the components and logos on the board to prevent the cleaning agent from entering the unsealed components, so as not to cause damage to the components.     4. Some electronic components are prohibited from contacting special cleaning agents, such as: key switches, buzzers, batteries, plastic components, etc.     5.  During the cleaning process, metal such a

      The first article PCBA processing inspection means that the PCBA inspects the first produced PCBA product in each processing link. The first article inspection is an important control point to inspect the processing quality of the product. The first article must meet the document requirements before mass production.       First article inspection can detect problems as early as possible and prevent batch errors during PCBA processing.  Through the first   article   inspection, it can be found whether there are errors such as mi spaste , missing   paste   or multiple  paste   on the PCBA board, and corrective or improvement measures can be taken in time.     At present, many PCBA processing factories use the first article detector to judge the first article, only need to input the product's BOM, coordinates, bit number map, and then the system will automatically check the first article of product. It can check whether the data in the BOM is consistent with processing, can also

       Via plugged with resin can solve the problems that green oil plug holes can't solve, but the characteristics of the resin used in this process need to overcome many difficulties in production in order to obtain good quality resin products. So why do PCB   vias plugged with resin ?       Traditional BGA may make vias between pads to the back for routing.  If the BGA is too dense, it is impossible to route from the  vias   to the back, but you can drill directly from the pad to   other layers   for routing , then plug the  via s with resin, and plate copper to form the pad.   If only holes are made on the pads without resin plug holes,  it will easily lead to short circuit on the back and virtual   soldering   on the front.     The PCB vias plugged with resin process includes drilling, electroplating, plugging, baking, and grinding. The holes are drilled and copper plated, then the resin is plugged and baked, and the resin is ground flat by grinding. Because the ground resin d

     Reflow soldering and wave soldering are 2 common soldering methods in PCBA processing. What is their role in PCBA processing? What ’ s the differences?       What is Reflow Soldering? It is to heat and melt the solder paste pre-applied on the pad, and the electronic component pins or welding ends on the pad are electrically interconnected with the pad on the PCB, so as to achieve the purpose of soldering electronic components on the PCB board. Reflow soldering is generally divided into preheating zone, heating zone and cooling zone.     What is wave Soldering? It is to use a pump to spray the molten solder into a wave soldering, and then pass the pins of the electronic components to be soldered through the wave soldering to realize the electrical interconnection of the electronic components and the PCB board.  Wave soldering is divided into four parts: spraying, preheating, tin furnace and cooling.     The difference between wave soldering and reflow soldering: 1. Reflow soldering

      Copper is used to interconnect components on the substrate. Although it is a good conductor material for patterning the conductive path of a printed circuit board, if exposed to the air for a long time, it will easily lose gloss due to oxidation, suffer corrosion and lose its solderability. Therefore, various technologies must be used to protect copper traces, vias, and plated through holes. These technologies include organic paint, oxide film, and electroplating. Organic paint is very simple to apply, but due to changes in its concentration, composition and curing cycle, it is not suitable for long-term use. It will even cause unpredictable deviations in weldability. The oxide film can protect the circuit from corrosion, but cannot maintain solderability. Electroplating or metal etching technologies are standard operations to ensure solderability and protect circuits from corrosion, and play an important role in the manufacture of single-sided, double-sided and multilayer printe

      The mobile phone camera is one of the important parts of the mobile phone.   In the process of assembling mobile phone cameras, FPC is essential. Without the support of FPC, the camera of the mobile phone cannot take pictures and generate pictures. So what role does FPC play in the camera?       In the composition of the mobile phone camera, the FPC is the circuit connection part of the CMOS sensor.   One end of the FPC can be connected to the gold wire of the CMOS sensor, and the other end can be connected to the mainboard of the mobile phone, thereby realizing a complete circuit. In the camera of the mobile phone, the functions of the FPC are as follows: 1. Provide electrical characteristics and play the role of electrical connection; 2.  Provide mechanical properties to support the fixation and assembly of electronic components; 3.  It can realize automatic mounting, welding and testing between integrated circuits and electronic components.     The FPC in the mobile phone came

  What is Red Glue? Red glue is a kind of polydilute compound, it will solidify after heating, the freezing point temperature is 150  ℃ , and the paste will become solid directly.       What is Solder Paste? Solder paste is a new type of soldering material that came into being with SMT.   It is a paste-like mixture formed by mixing solder powder, flux and other surfactants, thixotropic agents, etc.       The Difference between Solder Paste and Red Glue: 1. Red glue is red paste, and solder paste is gray paste.     2. The main function of the red glue is to fix the components on the PCB, so as to prevent the components from falling off during wave soldering. Red glue does not conduct electricity, it only plays a role in fixing. Solder paste is to solder the components on the PCB pads, and can complete the mechanical and electrical connection between the components and the PCB through the current.     3. The red glue is applied on the PCB solder mask between the two pads. The solder past

       In SMT processing, solder paste is an important raw material in production.   The selection of solder paste is very important, which is directly related to the quality of final products. So, what are the requirements for solder paste in SMT processing?       1.   Long storage life is required.  The solder paste can be stored for 3 to 6 months at 0 ~ 10 ℃, and there should be no chemical change during storage, and the phenomenon of separation of solder powder and flux should not occur,  and the viscosity and adhesion of solder paste need to remain unchanged.     2.  Good wetting performance is required.   In SMT processing, the active agent and wetting agent components in the flux should be selected correctly, so as to better meet the wetting performance requirements.     3. Long working life is required. Solder paste has been used for a long time in SMT processing, so the solder paste should be able to be placed at room temperature for 12 to 24 hours and the performance should r