PCB Blogger-China PCB Factory,HOYOGO

      Due to the existence of water molecules in the air, if the PCB is exposed to the air for a long time, the external moisture may enter the PCB board, and the purpose of baking is to remove moisture, and evaporate the excess moisture in the PCB by heating.       If the content of water molecules in the PCB exceeds the relevant regulations, in the process of high temperature reflow soldering, wave soldering or hand soldering, these internal water molecules will be heated and atomized into water vapor will expand rapidly as temperature rises. The higher the temperature, the larger the atomization volume. When the water vapor cannot escape from the PCB in time, it is likely to expand the PCB, thereby breaking the via holes between the PCB layers, causing the separation of the layers of the PCB. In severe cases, blistering, expansion, and board explosion can be seen from the outside of the PCB.     Sometimes the above problems cannot be seen on the outside of the PCB, but in fact the i

       Electroplating is a necessary production process in PCB production, in which horizontal plating is more functional than vertical plating, and it is easier to achieve large-scale production. So what are the advantages of horizontal plating?       1. Horizontal plating does not need to reserve a clamping position, which increases the practical area and greatly saves the loss of raw materials.     2. It can adapt to a wide range of sizes without manual installation and hanging, realize fully automatic operation, and ensure that there is no damage to the surface of the PCB board during processing, which is extremely beneficial for mass production.     3. Horizontal plating is computer controlled throughout the process to ensure uniformity of surface and hole coating on each printed circuit board under the same conditions.     4. The cleaning of the plating tank to the addition and replacement of the plating solution can be fully automated without human error, and labor costs can be

      Aluminum PCB   is a metal substrate with good heat dissipation function. Generally, the single-sided aluminum PCB is composed of three layers, which are the circuit layer, the insulating layer and the metal base layer. It is usually used in power products, especially in the LED field. So, what are the advantages of aluminum PCB?       1. As we all know,  high temperature will affect electronic equipment ,  so it is necessary to choose a circuit board with good heat dissipation, and the aluminum  PCB  can effectively deal with heat dissipation, reduce the operating temperature of the module, and improve reliability.  Reduce the assembly area of radiators and other hardware, reduce product volume, and reduce hardware and assembly costs.     2. The aluminum PCB meets environmental requirements, is recyclable, helps save energy, and is easy to assemble.     3. Aluminum PCB, copper PCB, and iron PCB, all belong to metal substrates Comparison of the three: Aluminum PCB are much lighter

       In the PCB manufacturing process, solder paste or tin wire is usually used to solder components on the PCB in order to achieve circuit connection and electrical performance. However, during the PCB manufacturing and assembly process, there will inevitably be waste and residue of solder paste or tin wire, and these excess tin slag will have a negative impact on the performance and reliability of the PCB. So how to remove excess tin slag on PCB?       1.  Manual Removal Method Manual removal is a simple and primitive method of removal.   It is primarily done manually, using hand tools to remove excess tin slag. For example: scraper, brush, spray gun, etc.     Advantages: Simple and easy to operate, no equipment and materials are required, only operators with certain skills and experience are required. It can also be personalized for different PCB and tin slags, with high flexibility and plasticity.     Disadvantages: It is inefficient, error-prone, and low-precision, and if it is

      In the process of SMT  welding  processing,  soldering  flux is often used, so what is the effect of using  soldering  flux?       1. Remove oxide The Abietic  A cid in the  soldering  flux can  have a reduction  react ion   with the oxide film on the surface of the welded metal to generate  C opper  Abietate , which can remove oxides or other  dirt   on the soldering surface.     2. Prevent secondary oxidation During  SMT  welding processing , the  soldering  flux will cover the surface of the welded metal and solder , which can  isolate it from the air and prevent  the  secondary oxidation of the solder.     3. Reduce solder tension When the  soldering  flux removes the oxide on the soldering surface, a certain chemical reaction occurs, which can reduce the surface tension and viscosity of the solder, while increasing the surface activity, thereby improving the wettability of the solder.     4.  Better heat transfer The soldering flux reduces the surface tension and viscosity o

       PCB is one of the essential components of electronic products, and its quality directly affects the performance of the entire product.  In order to protect the PCB and ensure the reliability of the product, the PCB manufacturer will pack the PCB. So what are the requirements for PCB packaging?       1.  Anti-static Because static electricity will interfere or damage the circuit, anti-static measures need to be taken during the PCB packaging process.   For example: PCB manufacturers will package PCBs in conductive layers or static shielding bags, or use packaging equipment with static elimination devices, etc.     2.  Waterproof and  M oisture - proof PCB are sometimes affected by humid environments, especially during transportation and storage. Therefore, during the PCB packaging process, it is necessary to pay attention to waterproof and moisture-proof. For example: PCB manufacturers will choose packaging materials with good airtightness, and add hygroscopic agents, moisture-pr

      When the PCB is deformed, it is easy to cause problems such as poor circuit connection, component damage, signal interference, etc., and may even seriously threaten the quality and performance of the entire product. So how can we avoid PCB warping?       1.  Design Stage 1)  Reasonable layout of  component s We should tr y to avoid large  component s concentrated in the same area, forming a huge tension difference with other small  component s.  This can effectively reduce the PCB warpage problem caused by local stress.     2)  Control the thickness of copper foil The thickness of the copper foil in the PCB will also affect its warpage. Therefore, we need to make reasonable planning at the design stage, and control the thickness of each layer of copper foil to be as uniform as possible.     2.   Manufacturing  S tage 1)  Control manufacturing temperature and humidity Heating and cooling are unavoidable steps in the PCB manufacturing process. But these steps need to control the te