PCB Blogger-China PCB Factory,HOYOGO

       Electronic products and equipment used in our daily life, as long as there are electronic components such as integrated circuits, there is the existence of PCB.   In PCB processing, due to the differences in technical requirements and manufacturing capabilities, there are many special technologies with high technical threshold, high cost and long cycle.   So what are the relatively special PCB technologies?     1.  I mpedance  C ontrol When digital signals are transmitted on a PCB, the characteristic impedance value of the PCB must match the electrical impedance of the head and tail components. Once mismatched, the transmitted signal energy will be reflected, scattered, attenuated or delayed. In this case, impedance control must be performed to match the characteristic impedance value of the PCB to the component. 2.  Blind and Buried Via Blind Via: It is a hole in one of the top or bottom layers, but cannot be seen through .  Buried Via: It is on the inner layer of the PCB, the

       The quality and production efficiency of SMT processing  is   very critical to PCB, and the materials used for processing play a crucial role.   So what are the materials in SMT processing?   1.  S older  P aste Solder paste is a paste made by alloy solder powder and paste sol dering flux.   It is an indispensable solder material in SMT processing and is widely used in reflow soldering. Solder paste has a certain viscosity at room temperature, which can stick electronic components in designated positions, and then at the soldering temperature, with the volatilization of solvents and some additives, the soldered components are connected to the PCB to form a permanent connection.     2.  S oldering  F lux Soldering is the main process o f SMT processing,   and soldering flux is an auxiliary material used in soldering. Its main function is to remove the oxides on the surface of the solder and the material to be soldered, so that the metal surface can achieve the necessary cleanline

High   frequency PCB plays an important role in wireless communication, radar, satellite communication and other fields.   Choosing the right high   frequency PCB  base  material is crucial to ensure the performance and reliability of  the PCB .  However, since there are various types of PCB boards on the market, how to choose the right board becomes a key issue.   So how to choose high   frequency  PCB board?   Factors to consider when choosing high frequency PCB base material: 1)  Dielectric Constant :  The dielectric constant is an index to measure the electrical insulation ability of materials, which is especially important for high   -frequency  PCB . A lower dielectric constant helps reduce signal loss and signal distortion during signal transmission.     2)  Dielectric Loss Factor : Dielectric loss factor is a parameter to measure the degree of dielectric loss.  Choose materials with a low dielectric loss factor to ensure the accuracy and stability of signal transmission.     3)

       In the process of SMT processing and production, it is difficult to avoid the problem of material throwing of the  placement equipment . SMT throwing   materials   mainly refers to that  during the   SMT  placement  processing, the placement machine does not stick the components to the designated position after  suck ing the material s , but throws the components to the throwing box or other places, or does not  suck   the material s, so  above throwing action   is performed .   SMT  throwing   material s   will not only cause material s   loss es , but also reduce production efficiency and increase production costs.  So , in order to improve  SMT   production efficiency and reduce costs, the phenomenon of material throwing needs to be solved in time.  So  what are  the causes and solutions of the common throwing  materials  phenomenon?     1. Nozzle  problem The nozzle of the placement machine is deformed, blocked, etc., which leads to insufficient air pressure, air leakage, et

       PCBA factory  generally use wave soldering for soldering during the DIP   soldering   technology.  This can n ot only  improve   the  soldering  efficiency,  but also  realize  mass production . However,  some components that are not resistant to high temperatures cannot  be soldered by wave soldering.  At this time,  hand  soldering processing is required -  requiring employees  to solder with electric soldering irons.   Although  the speed of  hand solder ing processing is relatively slow, it is also a very important form of  solder ing.   Five reasons for why PCBA factory use hand soldering processing: 1. Components are not resistant to high temperature Nowadays , lead-free technology is becoming more and more popular.  During wave soldering, the temperature inside the furnace is higher than that of the lead.  So , some components that are not resistant to high temperature cannot  be soldered by wave soldering.     2. The components are too high Wave soldering is also limited