Questions about the Aluminum Substrate Layer
1. Circuit Layer
Generally, electrolytic copper foil is etched to form a printed circuit for assembly and connection of devices. Compared with the traditional FR-4, using the same thickness and the same line width, the aluminum substrate can carry higher current.
2. Insulation layer
It is the core technology of the aluminum substrate, which mainly plays the role of adhesion, insulation and heat conduction. The aluminum substrate insulation layer is the largest thermal insulation layer in the power module structure. The better the thermal conductivity of the insulating layer, the more beneficial it is to the diffusion of heat generated during the operation of the device, and the lower the operating temperature of the device to increase the power is more favorable. The load of the module reduces the volume, extends the life, and increases the power output. A typical motor controller module uses a large number of heat sinks, thermal interface materials, and other accessories. The module has large volume, complicated structure and high assembly cost. On the left side, since an aluminum substrate with high thermal conductivity is used, a highly automated surface mounting product is obtained. The number of components of the entire product was reduced from 130 to 18, the power load was increased by 30%, and the module volume was greatly reduced. Such high power density modules can only be applied to aluminum substrates with high thermal conductivity.
3. Metal Substrate
Which metal to use depends on the comprehensive consideration of the thermal expansion coefficient, thermal conductivity, strength, hardness, weight, surface state and cost of the metal substrate. Generally, considering the cost and technical performance, the aluminum plate is the ideal choice. If higher thermal conductivity, mechanical properties, electrical properties and other special properties are required, copper plates, stainless steel plates, iron plates and silicon steel plates can also be used.
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