PCB Blogger-China PCB Factory,HOYOGO

  Most people cannot tell the difference between a double-sided circuit board and a multilayer circuit board with the naked eye. If you do not carefully distinguish the appearance of a double-sided circuit board and a multilayer circuit board, you cannot distinguish between them, because their appearance is basically the same. Someone may ask: Isn't a multilayer circuit board multi-layered? How does it look like it's just a wooden board? Why is the price so much higher? In fact, the number of layers of the multilayer circuit board is shown in the inner layer. 1-2 layer board, 1 layer is called single board, 2 layer is called double-layer board, 3-48 layer is called multi-layer board. The higher the number of layers, the higher the unit price, because the inner layers are to be pressed together. The pressing process has a high technical content, and in terms of machinery, the price of renting or buying the machine is relatively high. It is not cost-effective to buy the machine,

  Nowadays, electronic products are developing towards miniaturization, funtionalization, high performance and high reliability. The high-frequency board is   high-frequency circuit board , which is one of the most difficult boards, so it must meet the production requirements as much as possible. It has been widely used in various industries such as heat processing, heat treatment, thermal assembly, welding and melting of special materials. It can not only heat the workpiece as a whole, but also heat the workpiece in a targeted manner. It can realize the deep penetration of the workpiece, or it can only heat the surface and the surface layer. It can not only directly heat metal materials, but also indirectly heat non-metal materials. So, induction heating technology will be more and more widely used in various industries. Its various physical characteristics, accuracy and technical parameters require very high, and it is often used in automobile collision avoidance systems, satellite s

  First:  The  P urpose of  B lackening and  B rowning   1. Remove pollutants such as oil and impurities on the surface; 2. Increase the specific surface area of the copper foil, thereby increasing the contact area with the resin, which is conducive to the full diffusion of the resin and the formation of greater bonding force; 3. Turn the non-polar copper surface into a polar CuO and Cu2O surface to increase the polar bond between the copper foil and the resin. 4. The oxidized surface is not affected by high temperature and humidity, thereby reducing the chance of delamination between the copper foil and the resin. 5. Circuit boards with internal circuits must be blackened or browned before being laminated. It is to oxidize the copper surface of the inner board. Generally, the produced Cu2O is red and CuO is black, so the Cu2O-based oxide layer is called browning, and the CuO-based oxide layer is called blackening.     Laminating is the process of bonding each layer of the circuit into

  1. First, there must be a reasonable direction.   Such as input/output, AC/DC, strong/weak signal, high frequency/low frequency, high voltage/low voltage, etc... Their directions should be linear or separate, and they cannot merge with each other. Its purpose is to prevent mutual interference. The best trend is a straight line, but it is usually not easy to achieve. The most unfavorable trend is a circle. Fortunately, isolation can be improved. For DC, small signal, low voltage PCB design requirements can be lower. So "reasonable" is relative.   2. Second, choose a good ground point: The ground point is usually the most important.       Many engineers and technicians have discussed this small ground point, which shows its importance. Under normal circumstances, a common ground is required, such as: multiple ground wires of the forward amplifier should be combined and then connected to the main ground, etc.... In fact, due to various restrictions, it is difficult to achieve