What are the Requirements of PCBA Processing for PCB？

If the PCB does not meet the requirements, it will increase the difficulty of the PCBA soldering process, which may eventually lead to soldering defects or unqualified PCBA. So, in order to ensure the efficient completion of PCBA processing, the PCB should meet the following requirements as much as possible:

 

 

 

1. PCB Size

The ideal size of PCB (including board edge) is - width≧50mm, <460mm, length≧50mm. If the size of the design is too small, a panel includes 2 different kinds of PCB needs to be made.

 

 

2. PCB board edge width

The board edge width of the PCB needs to be >5mm, the panel includes 2 different kinds of PCB spacing <8mm, and the distance between the pad and the board edge is >5mm.

 

 

3. PCB bending

The warpage of the PCB board will affect the placement accuracy and will cause the PCB to move unevenly in the direction of the conveyor belt, so the warpage of the PCB board should be as small as possible. The requirements for bending degree are - upward bending degree: <1.2mm, downward bending degree: <0.5mm, PCB distortion: maximum deformation height ÷ diagonal length <0.25.

 

 

4. Mark point of PCB board

In the actual PCBA processing, we need to pay attention to many problems in the setting of Mark point of the board, and it is also more important. The size of Mark is generally in the range of 0.8~1.5mm. Its surface needs to be flat, smooth, free of oxidation and pollution. There should be no green oil or other obstacles within 1mm around the mark point, and the color should be obviously different. Its position needs to be more than 3mm away from the edge of the board, and there can be no Mark-like vias, test points, etc. within 5mm of it.

 

 

5. PCB pad

There must be no through holes on the pads of SMD components. If there is a through hole, the solder paste will flow into the hole, which will cause the device to lose tin or the tin flows to the other side, causing the board surface to be uneven and unable to print the solder paste.

 

 

The above are some of the requirements of PCBA processing for PCBs. Every link in the production of PCBs is required to be in place. Only by producing high-quality and qualified PCB can it better accept other special processes.

 


SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO., LTD. specializes in providing overall PCBA electronics manufacturing services, including one-stop services from upstream electronic component procurement to PCB production and processing, SMT patch, DIP plug-in, PCBA testing and finished product assembly. 

评论

发表评论

此博客中的热门博文

What are the Advantages and Disadvantages of the OSP Technology

图片
     With the continuous development of the electronics industry, there are more and more PCB surface treatment technologies, and each technology has its own merits. OSP is a commonly used surface treatment technology process, what are its advantages and disadvantages?       Compared with other surface treatment technologies, OSP is somewhat different.  It uses a chemical method to produce an organic film on the clean bare copper surface, which acts as a barrier between the copper and the air.   OSP is organic, not  metallic,   and its cost is lower than most surface treatment technologies.     Advantages: With this organic film, it can resist the attack of moisture in the air without being oxidized before welding,  can withstand the test of high temperature, maintain good activity, and has a good tinning ability.  This layer of organic film will not cause damage to the sheet material. It can be easily removed by the solder resist during soldering. It can solder the copper wire and the
阅读全文

What PCBA Problems Can AOI Inspect

图片
        With the development of science and technology, the volume of PCBA is getting smaller and more precise, and some defects in processing cannot be distinguished with the naked eye, so AOI has appeared.  So what PCBA problems can AOI inspect?   The working principle of AOI is to first collect and input parameters such as images, component positions, solder joints and other parameters of the good-quality board.   During the inspection, the instrument automatically scans the circuit board and automatically captures the image, and then compares the collected data with the pre-entered parameters to determine whether the characteristics of solder joints, components and other aspects are consistent. If the data is inconsistent, the d efect  will be flagged through the display for maintenance personnel to repair.     AOI is mainly used to inspect solder paste printing, component placement and soldering. For example: too much or too little solder paste,   solder paste printing offset;  co
阅读全文

The Role of Shield Cover in PCB Design

图片
  SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO., LTD. specializes in providing overall PCBA electronics manufacturing services, and can also provide customers with a full range of value-added services: including SMT assembly, PCB program development, schematic design, PCB layout and routing, Bom list matching, component procurement and other services. Do you know the role of shield cover in PCB design? What is a Shield Cover? The shield cover is an alloy metal cover, which is a vital component to reduce the radiation of the display. It is used in MID or VR products, which can effectively reduce the mutual interference between modules. It is common in the isolation between the main control function module and the power module and the Wifi module. The  P urpose of  S hield  Cover   C lip Generally, there are products that use wireless communication, and shield frames are usually designed on the circuit board to isolate electromagnetic interference (EMI). However, to make the shield frame fun
阅读全文