What Should be Paid Attention to in PCBA Repair

       When doing PCBA processing, we occasionally encounter some boards that need to be repaired. Repair is also a very important link. Once errors occur, it may directly lead to the scrapping of the circuit board. So what should we pay attention to when repairing?

 


1. If there are solder joint defects such as open circuit, bridge, and virtual soldering generated in the reflow or wave soldering process, it is necessary to use tools, such as BGA rework station, X-Ray, high-power microscope, etc., to remove various solder joint defects after trimming. So as to obtain qualified PCBA solder joints.

 

 

2. If the repair process needs to be heated above 110°C, or there are other moisture-sensitive components within 5mm of the repair area.

 

 

3. For moisture-sensitive components that need to be reused, if hot air reflow, infrared and other repair processes are adopted through the heating solder joint of the component package, it must be baked and dehumidified according to the moisture sensitivity level and storage conditions of the components. For the repair process using manual ferrochrome heating solder joints, pre-baking treatment is not required under the premise that the heating process is controlled.

 

 

4. After baking, moisture-sensitive components, PCBA, and new components to be replaced need to be re-baked once the storage conditions exceed the expiration date.

 

 

5. The total allowable repair heating of the component does not exceed 4 times The total number of repair heating allowed for new components is not more than 5 times. Dismantled and reused components should not be reheated more than 3 times.

 

 

6. Be careful not to damage the pad during repair. In addition, the component surface and PCB surface must be flat.

 

 

HoYoGo is an international, professional and reliable PCB manufacturer, including one-stop service from upstream electronic components procurement to PCB production and processing, SMT placement, PCBA testing, finished product assembly, etc.

评论

发表评论

此博客中的热门博文

What are the Advantages and Disadvantages of the OSP Technology

图片
     With the continuous development of the electronics industry, there are more and more PCB surface treatment technologies, and each technology has its own merits. OSP is a commonly used surface treatment technology process, what are its advantages and disadvantages?       Compared with other surface treatment technologies, OSP is somewhat different.  It uses a chemical method to produce an organic film on the clean bare copper surface, which acts as a barrier between the copper and the air.   OSP is organic, not  metallic,   and its cost is lower than most surface treatment technologies.     Advantages: With this organic film, it can resist the attack of moisture in the air without being oxidized before welding,  can withstand the test of high temperature, maintain good activity, and has a good tinning ability.  This layer of organic film will not cause damage to the sheet material. It can be easily removed by the solder resist during soldering. It can solder the copper wire and the
阅读全文

What PCBA Problems Can AOI Inspect

图片
        With the development of science and technology, the volume of PCBA is getting smaller and more precise, and some defects in processing cannot be distinguished with the naked eye, so AOI has appeared.  So what PCBA problems can AOI inspect?   The working principle of AOI is to first collect and input parameters such as images, component positions, solder joints and other parameters of the good-quality board.   During the inspection, the instrument automatically scans the circuit board and automatically captures the image, and then compares the collected data with the pre-entered parameters to determine whether the characteristics of solder joints, components and other aspects are consistent. If the data is inconsistent, the d efect  will be flagged through the display for maintenance personnel to repair.     AOI is mainly used to inspect solder paste printing, component placement and soldering. For example: too much or too little solder paste,   solder paste printing offset;  co
阅读全文

The Role of Shield Cover in PCB Design

图片
  SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO., LTD. specializes in providing overall PCBA electronics manufacturing services, and can also provide customers with a full range of value-added services: including SMT assembly, PCB program development, schematic design, PCB layout and routing, Bom list matching, component procurement and other services. Do you know the role of shield cover in PCB design? What is a Shield Cover? The shield cover is an alloy metal cover, which is a vital component to reduce the radiation of the display. It is used in MID or VR products, which can effectively reduce the mutual interference between modules. It is common in the isolation between the main control function module and the power module and the Wifi module. The  P urpose of  S hield  Cover   C lip Generally, there are products that use wireless communication, and shield frames are usually designed on the circuit board to isolate electromagnetic interference (EMI). However, to make the shield frame fun
阅读全文